Copper-plated round steel-Copper-plated round wire is suitable for grounding lightning protection under different soil humidity, temperature, pH value and resistivity changes. It is often used as a lightning protection strip for roof daughter walls, vertical ground lead-in, lead-down, and horizontal ground connection.
Copper-plated round steel ground wire manufacturers are suitable for horizontal grounding bodies with high requirements for working grounding, protective grounding, lightning protection grounding, and antistatic grounding in general environments and special environments where humid, saline, acidic soils produce chemically corrosive media. The mechanical properties of electroplated copper-clad steel are more excellent. It is recommended that the thickness of the copper layer be increased for those with severe corrosion. Copper-plated round steel not only has the high strength of steel, but also has excellent elasticity, large thermal resistance and high magnetic permeability. It also has better electrical conductivity and excellent corrosion resistance. Copper is electroplated. Copper process: The high-purity electrolytic copper is completely adhered to the steel core through the principle of electrolysis, forming an alloyed molecular-level structure on the copper-steel interface, and the bimetal interface is completely combined to achieve a ductile metallurgical connection between copper and steel. And form a whole. The manufacturer of copper-plated round steel ground wire has excellent corrosion resistance. Because the copper-steel bonding interface is welded at high temperature, there will be no residue on the bonding surface and no corrosion phenomenon; the surface copper layer is thicker (average thickness is greater than or equal to 0.254mm) Strong corrosion resistance, longer service life than 50 years, can greatly reduce maintenance labor intensity. The electroplating production process is used to achieve the high combination of copper and steel. The surface copper layer is composed of 99.99% electrolytic copper molecules, which not only overcomes the disadvantages of the primary battery reaction existing in the sleeve production process, but also solves the lack of purity of the copper layer and hot and cold copper surface on the surface. And so on.
2.Excellent corrosion resistance
The copper layer on the surface of the material is thick and is 99.99% of electrolytic copper molecules, with an average thickness of more than 0.25mm, so it has strong corrosion resistance and a service life of more than 50 years.
3. Better conductivity
Because the surface copper layer is composed of 99.99% of electrolytic copper molecules, it has excellent electrical conductivity and its own resistance is far lower than that of conventional materials.
4.Wide range of use
The product is suitable for soil conditions with different humidity, temperature and pH values.
5. Safe and fast installation
Complete accessories, using a special connection pipe or using Enron hot-melt solder connection, the joint is firm and easy to install, which greatly improves the construction efficiency.
6. Reduced construction costs
Compared with the traditional grounding with pure copper material, the cost is greatly reduced.
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